coupled thermal-electric-mechanical analysis of a device with heat sink combs

TeferiTeferi Member

Hello everyone,

I am Teferi. I am doing a coupled thermal-electric-mechanical analysis on a device with heat sink combs to dissipate heat from the device to the outside air by convection. In the material property part, I have included density, Isotropic properties, coefficient of thermal expansion, and thermal conductivity of the material. And, also in the boundary condition part, I have considered Temperature, Voltage, Fixed constraint, and convective heat transfer coefficient of the material.

But, when I simulated it in Ansys workbench, the temperature distribution on the device with and without heat sink combs is the same. So, can you give me some suggestions or comments on the material properties as well as the boundary conditions?

With best regards


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