Specify Internal Stresses and Stress Gradients

I am looking to model thin film bilayers at cryogenic temperatures.


One layer (the substrate, silicon nitride) has an intrinsic stress gradient in the direction of its height (lets call it z) due to its processing. It is usually about 1 um thick. The top layer is made up of ~200 nm evaporated gold. This will have a compressive stresses in the x and y directions. 


How can I specify these stresses before I set the temperature to ~80 kelvin and measure the thin film's curvature due to thermal induced stresses? 


I am using Ansys Workbench 2017 with a full research license. 


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