Hi sir,nI am attaching screenshots which show the tabular data cycling from -40deg to 125 deg. It is a IGBT module where the thermal condition is applied to the entire body. The boundary conditions applied are a compression only support at the bottom of the base plate and zero displacement at the terminal holes. In Analysis settings, initial time step was 100s, with minimum time step of 50 s and maximum time step of 600s. Solution information says the solution is not converged at time 7000 with load step 8 because contact pair is inactive. I am not sure how to fix this. I am trying to analyse the stress and strain in the solder layer of the chip. ]nnnnnn