The environment temperature is 280c.
The reference temperature of all materials is 22c.
In step 1, the load is same as environment temperature i.e., 280c. In step 1 , the load(280c) is kept constant for 1 minute. Then it is ramped down in other steps.
I have already used the initial step as 1e-4, still not converging. I even went till 1e-8, there is no convergence.
Ok i will turn on large deflection and run the simulation.
I added week springs as i am performing simulation on chip and substrate bonded with interconnect. Here they attach through bonded contacts. So, i turned on weak springs. And i also need to check warpage of chip and substrate, so it doesn't make sense to give boundary conditions.
And yeah i am using only direct solver.