I forget to mention, it appears you are using a post processing tool that is intended to extract damping ratio associated with squeeze film elements (which are usually used to model the gas - air - occupying a thin gap between a MEMS device, e.g., micro mirror, and the substrate beneath it):
Your assembly does not appear to be a MEMS device (with dimensions on the micron-to-single millimeter scale), nor does it appear to have squeeze film elements in it. In short, the post processing object you appear to be using almost certainly does not pertain to your model.
Best,
Bill
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