Thank you for your reply, I am actually asking about the pcb components properties... as you know PCB components consider any IC eg BGA now this will be modelled as just one block and to define properties of this component what should we consider like outer package that is encapsulation or inside chip material like silicon or etc...
For reference consider Sherlock how does it specify any component properties whether it consider the outer package or inside material?
You are navigating away from the AIS Discovery experience