- The mass of sensors (acceleraometers) used is less than 1 gm, whether this will affect ?
- There are no components mounted on the PCB , vibration is done for the bare PCB. In the picture attached whatever visible is copper trace on PCB , according to copper content equivalent properties are calculated and used here.
- I can include damping but what will be the value of it , as during actual vibration test Q observed for a typical sensor is as below.
I used trace mapping , to get the copper percentage in each layer and then calculated the equivalent properties of PCB using Ansys FR4 & Copper mechanical properties.
Can you explain what why i should model assembly shown in above figure and what will be boundary condition?
Thanks in advance.