@ Erik 


  1. The mass of sensors (acceleraometers) used is less than 1 gm, whether this will affect ?
  2. There are no components mounted on the PCB , vibration is done for the bare PCB. In the picture attached whatever visible is copper trace on PCB , according to copper content equivalent properties are calculated and used here.
  3. I can include damping but what will be the value of it , as during actual vibration test Q observed for a typical sensor is as below.

I used trace mapping , to get the copper percentage in each layer and then calculated the equivalent properties of PCB using Ansys FR4 & Copper mechanical properties.

Can you explain what why i should model assembly shown in above figure and what will be boundary condition?


Thanks in advance.