-
-
February 16, 2023 at 11:36 am
Kyle McNeil
SubscriberHello,
I am using the Icepak Toolkit PCB model (Icepak > Toolkit > Geometry > PCB) in some PCB thermal models I am working on and I noticed that the "via material" Ansys creates to model a via array in a PCB has an anisotropic thermal condictivity. The axial thermal conductivity ("through the via array") seems to be calculated based on the provided PCB and via parameters. However, the radial thermal conductivity ("across the via array") seems to default to the thermal conductivity of whatever material is specified as the PCB substrate (in this case, FR4). This radial thermal conductivity does not seem accurate since in reality, it also depends on the copper weight, number of copper layers, fill factor of each copper layer, via diameter, via density and via filler material. Each of these parameters is specified for this Toolkit model but Ansys seems to make the radial thermal conductivity that of the substrate material regardless of what is specified for these other parameters.
Short of modelling the exact geometry of the PCB via array or importing a PCB .ODB file (not possible with student version), is there a way to more accurately model the radial thermal conductivity of a PCB via array in Ansys Icepak?
-
March 3, 2023 at 5:36 am
Pdev
Ansys EmployeeHello Kyle,
Since you cannot import the .ODB file, we would recommend modeling the vias explicitly and ensure that it's meshed properly.
Thank you.
Pdev
-
- You must be logged in to reply to this topic.

Boost Ansys Fluent Simulations with AWS
Computational Fluid Dynamics (CFD) helps engineers design products in which the flow of fluid components is a significant challenge. These different use cases often require large complex models to solve on a traditional workstation. Click here to join this event to learn how to leverage Ansys Fluids on the cloud, thanks to Ansys Gateway powered by AWS.

Earth Rescue – An Ansys Online Series
The climate crisis is here. But so is the human ingenuity to fight it. Earth Rescue reveals what visionary companies are doing today to engineer radical new ideas in the fight against climate change. Click here to watch the first episode.

Ansys Blog
Subscribe to the Ansys Blog to get great new content about the power of simulation delivered right to your email on a weekly basis. With content from Ansys experts, partners and customers you will learn about product development advances, thought leadership and trends and tips to better use Ansys tools. Sign up here.
- Missing Analysis Systems from toolbox
- “An error occurred while starting the solver module.” – Maybe licence problem?
- Please recommend the configuration of the computer workstation
- FLUENT application Failed to start
- No license available at this time
- ANSYS License Manager Error
- Your product license has numerical problem size limits…..
- Acoustics model in Ansys 18.1
- Download 2019 R1 Student Products
- Minimum requirement
-
8762
-
4658
-
3151
-
1678
-
1456
© 2023 Copyright ANSYS, Inc. All rights reserved.