October 24, 2023 at 1:38 pmElena MaierSubscriber
so I have a specific problem:
my model contains a plate and on top of this plate is a smaller plate (cover plate) welded. See picture below:
The mode is fixed at the right end and it is pulled on the left end, so the model is under a tension.
The weld triangles and the big plat are a shared topology and so there are one body.
The contact faces/areas between the plate and the cover plate (upper plate) are in contact through friction, so I used frictional with the coefficient 0,2.
The weld triangles and the cover plate are welded together, so I used BONDED to attach them, but when I look at the displacements, they seperate. Although the definition is that there is no spereation. See the pictures below:
I would really appreciate, if someone knows a solution for that problem. Bacause I can´t use a complete shared geometry for the model, because there is no connection between the plate and the cover plate besides the friction.
Thank you so much in advance for your help!
October 25, 2023 at 6:06 amAkshay ManiyarAnsys Employee
Can you try to refine the mesh on the plate and weld? Also, try using MPC formulation with bonded contact.
October 25, 2023 at 8:36 amElena MaierSubscriber
Thank you so much for your help!
Now the faces should be really bonded right, and ANSYS interpolates in between them? So that it gives the information from the weld to the coverplate exactly, and it doesnt matter that the mesh isn´t continuously?
Thank you so much for your help!!!
This solved a lot of my problems.
Have a good day,
October 25, 2023 at 8:44 amAkshay ManiyarAnsys Employee
It is great that your issue is solved. For Bonded and No Separation Types of contact between two faces, a Multi-Point Constraint (MPC) formulation is available. MPC internally adds constraint equations to "tie" the displacements between contacting surfaces. This approach is not penalty-based or Lagrange multiplier-based. It is a direct, efficient way of relating surfaces of contact regions which are bonded. Large-deformation effects are supported with MPC-based Bonded contact.
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