Learning Forum

[nellysh2017]

Hello,

I'm modeling a multi physics problem to simulate thermocompression bonding. The process starts from room temperature and each part is heated up to two different temperatures while a pressure is applied to the top part to form the bonding. after bonding, bonded structure is cooled down to room temperature. My goal is to extract residual stresses after bonding is complete.

It seems like using coupled field physics allows for temperature and structural DOFs to be applied to nodes. I have set up the simulation and didn't get any errors, but when I check the temperature results, Temperature is show as 0Xe-315C which doesn't make sense. I don't know what part of my simulation set up is not correct. I'm using SOLID226 elements and also inserted thermal connections between different parts as well.

[dinhan0394]

Please some picture about setup in the problem.

[nellysh2017]

Thank you, here are the screen shots:

[nellysh2017]

[dinhan0394]

Hi,

I see you have a lot of settings in the problem but don't know which settings are applied to the body/object?

Please add more details.

[nellysh2017]

All the bodies are set as structural thermal. I have two temperature loads at upper and lower surfaces and a pressure load on the upper surface.

I applied structural-thermal contacts to all the contacts. I have convection on all the exposed surfaces as well.