heat仿真

- March 16, 2023 at 6:14 am
  
  LLL
  Subscriber
  
  老师您好！最近在做heat的热调谐仿真。用TiN加热硅波导，为什么温度变化会与论文中的理论值不符合呢？文章中波导中应该升温35K左右，但我的仿真只升了30K，与理论值有较大差别。在另一个人的论文中发现在热级与波导都是2um的情况下他50mw升温了37K，而我的仅10mW就升温了30K，请问造成这些差异的原因是什么呢？
  结构图
  边界条件
  zmin=300K
  对流h=10
  左右绝热
  期待您的回复！
- March 16, 2023 at 5:41 pm
  
  Guilin Sun
  Ansys Employee
  
  主要原因很可能是材料热学特性参数的差异。根据原浙江大学仇敏教授组发表的论文，材料热学参数在微纳尺寸与宏观尺寸差别很大。请先检查材料特性。
  其次是仿真区。HEAT假设是绝热边界，如果你不设置特殊边界条件的话。这样一来，热功率一样，体积小的话温度就高，体积大温度就低。
  请详细检查。
- March 17, 2023 at 1:30 am
  
  LLL
  Subscriber
  
  谢谢老师的回复，我的宽度已经很宽，在波导处温度随宽度变化已收敛，并且两边使用了绝热边界条件
- March 17, 2023 at 4:01 pm
  
  Guilin Sun
  Ansys Employee
  
  材料特性数据不同结果不同。有很多原因造成不同结果，我们很难发现是什么原因。需要你仔细检查仿真文件的设置，包括几何形状/材料/边界条件等。如果文献没有给出全部信息，很难重复。
  这个帖子是讲FDTD的，也许对HEAT有所帮助：
  Ansys Insight: 我的仿真结果为什么与文献或实验结果不一致?

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