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June 15, 2023 at 6:11 pm
Atefeh Sadrimofakham
SubscriberHello eveyone. I am working on wafer simulation in CMP process. Do you know how we can see/gain the results for material removal rate (MRR)? -
August 14, 2023 at 9:18 pm
Atefeh Sadrimofakham
SubscriberIn Chemical Mechanical Polishing process, we polish a Silicon Oxide/Nitride wafer on the Polyurthane pad. The ununiformity on the wafer surface will be decreased and flattened based on this process. So, I wonder if is there any possibilty to calculate the amount of the Material Removal Rate from the wafer surface? (It is something like erosion.) https://en.wikipedia.org/wiki/Chemical-mechanical_polishing. Here is more information about the CMP process.
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August 15, 2023 at 7:50 am
Praneeth
Ansys EmployeeHi Atefeh,
Please provide the Ansys tool name that you wish to use to help us serve you better.
Best regards,
Praneeth. -
August 15, 2023 at 5:24 pm
Atefeh Sadrimofakham
SubscriberAnsys Fluent
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August 17, 2023 at 8:58 am
Essence
Ansys EmployeeHello,
Did you try using the Ansys Rocky which can be coupled with Ansys Fluent for your application?
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