-
-
July 17, 2019 at 6:32 pm
zakmt293
SubscriberGreetings
Respected experts I hope you are in good health. I am working on simulation of single bubble growth in super heated domain. There is a very thin liquid layer beneath the bubble and above heat transfer surface known as micro layer as shown
Image showing microlayer (Image taken from Thermal-Fluid Pedia from the discussion of nucleation and inception)
If you can see above in the image there is a mention of micro layer. Its thickness is in micro meter and in a very short interval of time it evaporates. The heat flux for micro layer is obtained by assuming 1-D heat conduction
Heat flux per unit area= kl*(Tw-Tsat)/(t_m)
eq(1)
kl= Thermal conductivity of water Tw= Wall temp Tsat= 373; t_m= Microlayer thickness
If we multiply eq (1) with interfacial area and then divide it by latent heat to get mass in kg/m3-sec it leads to a very high value of mass and leads to courant number crossing its limit.
To maintain courant number in its limit time step of 1e-12 is adopted. But it would take huge time to reach upto 46 milli seconds which would be needed to compare it with experimental data.I am just interested in increase in volume that would occur due to the evaporation of this thin layer. Can the experts give me any idea so that I could incorporate this mass to just see the behavior of bubble. Any idea in any form would be highly appreciated. I would be thankful for suggestions of experts.
Thank You
Zeeshan Ahmad Khan
-
July 18, 2019 at 6:19 am
DrAmine
Ansys EmployeeI remember I saw this micro-layer evaporation as part of a sub-grid wall boiling model. The effects have been modeled and not resolved.
What do you want to do? Resolve the whole process or model the boiling here?
-
July 18, 2019 at 6:42 am
zakmt293
SubscriberThank You
Now there is a hopeful chance. No I am not interested in resolving the whole process but interested in mass transfer and heat flux. Can you more elaborate how could this be made possible. I would be very thankful for your suggestions.
Thank You
Zeeshan Ahmad Khan
-
July 18, 2019 at 8:42 am
DrAmine
Ansys EmployeeMicro-Layer evaporation Model is still state of research:
https://www.casl.gov/sites/default/files/docs/CASL-U-2013-0099-000.pdf
In Fluent you can deal with thin-film model (after Kolev)
-
July 18, 2019 at 9:33 am
zakmt293
SubscriberGreetings
Can you tell me more about thin film model of Kolev. I am not getting it properly. Can you share with me any link that could describe it.
Thank You
-
July 18, 2019 at 10:08 am
-
- You must be logged in to reply to this topic.

Boost Ansys Fluent Simulations with AWS
Computational Fluid Dynamics (CFD) helps engineers design products in which the flow of fluid components is a significant challenge. These different use cases often require large complex models to solve on a traditional workstation. Click here to join this event to learn how to leverage Ansys Fluids on the cloud, thanks to Ansys Gateway powered by AWS.

Earth Rescue – An Ansys Online Series
The climate crisis is here. But so is the human ingenuity to fight it. Earth Rescue reveals what visionary companies are doing today to engineer radical new ideas in the fight against climate change. Click here to watch the first episode.

Ansys Blog
Subscribe to the Ansys Blog to get great new content about the power of simulation delivered right to your email on a weekly basis. With content from Ansys experts, partners and customers you will learn about product development advances, thought leadership and trends and tips to better use Ansys tools. Sign up here.
- Suppress Fluent to open with GUI while performing in journal file
- Floating point exception in Fluent
- What are the differences between CFX and Fluent?
- Heat transfer coefficient
- Getting graph and tabular data from result in workbench mechanical
- The solver failed with a non-zero exit code of : 2
- Difference between K-epsilon and K-omega Turbulence Model
- Time Step Size and Courant Number
- Mesh Interfaces in ANSYS FLUENT
- error in cfd post
-
3670
-
2550
-
1749
-
1226
-
582
© 2023 Copyright ANSYS, Inc. All rights reserved.