Learning Forum

[BALA]

Hello all, 

I am doing Modal analysis of PCB Board where board is populated with some components, I want to know how we should model this PCB Board with components. As per my reading there are few approaches like first one is removing all the component smearing the mas over the board, second one with this mass artificially increase the stiffness ( But i don't how much it should be) then last one is keeping all the major components on pcb with assigning a material properties, I need to use last one approach where i will keep major component on PCB but the issue here is what properties should i consider of these particular PCB Components , As we know PCB components like BGA or any ICs are made of different material so how do we actually assign material for these?

Overall my question is regarding what properties we should assign to pcb board components , shall we assign property of package material or what 

[Ankush Choudhary]

Hi Bala,

To perform modal analysis, you need to have Density, Modulus of Elasticity and Poisson's ratio material properties. Then you can assign the material property to the component inside mechanical.

Please check out the below course on Modal analysis.

https://courses.ansys.com/index.php/courses/modal-analysis/lessons/intro-to-modal-analysis-lesson-1/

In addition, please check the below post on PCB modal analysis.

https://forum.ansys.com/forums/topic/modal-analysis-on-pcb/

[BALA]

Thank you for your reply, I am actually asking about the pcb components properties... as you know PCB components consider any IC eg BGA now this will be modelled as just one block and to define properties of this component what should we consider like outer package that is encapsulation or inside chip material like silicon or etc...

For reference consider Sherlock how does it specify any component properties whether it consider the outer package or inside material?