June 24, 2021 at 5:35 pmjohn.x.juveliSubscriber
I am trying to understand the temperature effects via radiation and conduction on solder reflow of a 63%/37% Tin/Lead that has a liquid phase at 183 C... I presume I would start with solidifcation/melting as an input equation, but what exactly does the solver need to establish the proper material properties and does anyone have any literature understanding if this type of material already has some PCM data available?June 25, 2021 at 6:56 amDrAmineAnsys EmployeeI can just comment on the modeling part: you got it right: solidification and melting model is the way to go when using Ansys Fluent.
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