LS Dyna

LS Dyna

Using T-Shell in LS DYNA


      I'm doing a simulation and I'm worried about modeling the display.

      The display has many layers that are very thin.

      Some layers are soft enough to consider thickness changes, so I don't use shells (shells are ignoring thickness direction changes, as I know) , so I am modeling each layer as solid but I think it might be very inefficient.  So what I read recently is t-shell and composite materials , can this help? Is there any documents or data I can get related to? And the printed circuit board (PCB) is also being modeled as a solid mesh, so I'm considering using t-shell for this as well.

      I am usually doing drop or steel-ball drop simulation.

      And I'm not looking for damage to the display itself, but I'm interested in damage to the components below the display.

      Apart from t-shell, please share if you have any good suggestions for this kind of modeling.

    • Ram Gopisetti
      Ansys Employee

      Hi, you can use the Tshells to model the PCB with atleast 3 or more elements through its thickness, "damages" like erosion or the sum of plastic strain of failure as in Material cards. 

      Cheers, Ram 


    • Andreas Koutras
      Ansys Employee

      Here is the remark from the manual on the different tshell formulation.

Viewing 2 reply threads
  • You must be logged in to reply to this topic.