Learning Forum

[deld]

I'm interested in performing a Thermal Topology Optimisation with respect to the LPBF additive manufacturing process. Specifically, I'm interested in managing/optimising the development of thermal stresses during the build process (rather than, for example, the in-service heat flow of the final part). 

In the Help guides, I was able to find a section titled Using Topology Optimization for Additive Manufacturing. However, it seems to me that the guide is aimed towards optimising the topology with respect to the structural boundaries/conditions of the final part (i.e., loads or heat flow in the final part). 

For the above simulation, the workflow suggested is shown below:

I'm unsure how to approach the required workflow for optimisation of the AM process. How would I change this workflow to instead focus on thermal stresses during the AM process? Does the below workflow seem an appropriate starting point? 

1. Transient thermal analysis (AM process) > structural analysis > topology optimisation model > structural analysis > transient thermal analysis (AM process) > structural analysis

[John Doyle]

You can feed a thermal system result into the Structural Optimizer and Optimize on a Thermal Compliance.  This result should be able to feed into an AM workflow.  Give it a try.